Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes

标题
Thermal Analysis of High-Power Flip-Chip-Bonded Photodiodes
作者
关键词
-
出版物
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 35, Issue 19, Pages 4242-4246
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2017-08-08
DOI
10.1109/jlt.2017.2736884

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