Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Title
Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition
Authors
Keywords
3D integration, Cu-Cu bonding, low temperature, silver nanoparticles, physical vapor deposition
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 47, Issue 2, Pages 988-993
Publisher
Springer Nature
Online
2017-11-07
DOI
10.1007/s11664-017-5831-z

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