Mechanical and thermal characterizations of non-metallic components recycled from waste printed circuit boards

Published 2017 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Mechanical and thermal characterizations of non-metallic components recycled from waste printed circuit boards
Authors
Keywords
Waste printed circuit boards, Woven glass fiber, Brominated epoxy resin, Dimethylformamide, Dissolution, Separation
Journal
JOURNAL OF CLEANER PRODUCTION
Volume 167, Issue -, Pages 271-280
Publisher
Elsevier BV
Online
2017-08-26
DOI
10.1016/j.jclepro.2017.08.195

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.