Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation

Title
Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation
Authors
Keywords
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Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 57, Issue 2S1, Pages 02BA04
Publisher
Japan Society of Applied Physics
Online
2017-12-28
DOI
10.7567/jjap.57.02ba04

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