Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation

标题
Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation
作者
关键词
-
出版物
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 57, Issue 2S1, Pages 02BA04
出版商
Japan Society of Applied Physics
发表日期
2017-12-28
DOI
10.7567/jjap.57.02ba04

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search