Fast thermal analysis for fixed-outline 3D floorplanning

Published 2017 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Fast thermal analysis for fixed-outline 3D floorplanning
Authors
Keywords
3D IC, Thermal analysis, Floorplanning, TSV assignment
Journal
INTEGRATION-THE VLSI JOURNAL
Volume 59, Issue -, Pages 157-167
Publisher
Elsevier BV
Online
2017-07-07
DOI
10.1016/j.vlsi.2017.06.013

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.