Fast thermal analysis for fixed-outline 3D floorplanning - Peeref

标题

Fast thermal analysis for fixed-outline 3D floorplanning

作者

关键词

3D IC, Thermal analysis, Floorplanning, TSV assignment

出版物

INTEGRATION-THE VLSI JOURNAL

Volume 59, Issue -, Pages 157-167

出版商

Elsevier BV

发表日期

2017-07-07

DOI

10.1016/j.vlsi.2017.06.013

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