The Effect of Cu:Ag Atomic Ratio on the Properties of Sputtered Cu–Ag Alloy Thin Films

Atomic arrangement in immiscible Ag–Cu alloys synthesized far-from-equilibrium

(2016) V. Elofsson et al.   ACTA MATERIALIA

Achieving high strength and high electrical conductivity in Ag/Cu multilayers

(2015) M. Z. Wei et al.   APPLIED PHYSICS LETTERS

Fabrication of nanoporous silver with open pores

(2015) M. Zhang et al.   SCRIPTA MATERIALIA

Pulse-Plating of Copper-Silver Alloys for Interconnect Applications

(2012) Igor Volov et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microstructure of electroplated Cu(Ag) alloy thin films

(2011) S. Strehle et al.   THIN SOLID FILMS

Synthesis of nanostructured Ag–Cu alloy ultra-fine particles

(2009) Manjeet Singh et al.   MATERIALS LETTERS

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

(2009) S. Strehle et al.   MICROELECTRONIC ENGINEERING

Electrical properties of electroplated Cu(Ag) thin films

(2008) S. Strehle et al.   THIN SOLID FILMS

Agglomeration behavior of Ag films suppressed by alloying with some elements

(2008) K. Sugawara et al.   VACUUM

On the factors affecting the critical indenter penetration for measurement of coating hardness

(2008) J. Chen et al.   VACUUM

Structure and mechanical properties of Cu–Ag nanocomposite films

(2007) F. Misják et al.   THIN SOLID FILMS