Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

Published 2009 View Full Article

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Title
Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 86, Issue 12, Pages 2396-2403
Publisher
Elsevier BV
Online
2009-05-08
DOI
10.1016/j.mee.2009.04.028

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