Journal
SURFACE & COATINGS TECHNOLOGY
Volume 306, Issue -, Pages 190-193Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2016.05.075
Keywords
SiC; Doping; Implantation damage; Diffusion; Activation; Annealing
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Ion implantation is a key process technique for semiconductor materials, in particular silicon, for local tailoring of the semiconductor properties. The wide bandgap semiconductor silicon carbide (SiC) features outstanding material properties for high power and high temperature electronic devices, but the properties of SiC also make it difficult to manufacture and process the material. The development of implantation technology for SiC has therefore necessitated several changes, from mainstream silicon implantation technology. This paper will discuss the difficulties with implantation of SiC for manufacturing of electronic devices and also describe how the problems have been overcome, for instance by implantation at elevated temperatures and using high temperature post-implant annealing. (C) 2016 Elsevier B.V. All rights reserved.
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