Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Title
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Authors
Keywords
-
Journal
NANOTECHNOLOGY
Volume 27, Issue 33, Pages 335705
Publisher
IOP Publishing
Online
2016-07-07
DOI
10.1088/0957-4484/27/33/335705

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