Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

标题
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
作者
关键词
-
出版物
NANOTECHNOLOGY
Volume 27, Issue 33, Pages 335705
出版商
IOP Publishing
发表日期
2016-07-07
DOI
10.1088/0957-4484/27/33/335705

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