Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution

Published 2016 View Full Article

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Title
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution
Authors
Keywords
Palladium-coated copper, Palladium distribution, Intermetallic compounds, Copper wire bonding, Annealing, Growth kinetics
Journal
MICROELECTRONICS RELIABILITY
Volume 63, Issue -, Pages 214-223
Publisher
Elsevier BV
Online
2016-04-30
DOI
10.1016/j.microrel.2016.04.003

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