4.3 Article

Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

Journal

MATERIALS TRANSACTIONS
Volume 57, Issue 9, Pages 1411-1417

Publisher

JAPAN INST METALS
DOI: 10.2320/matertrans.MH201506

Keywords

severe plastic deformation (SPD); accumulative roll bonding (ARB); texture; copper; electron back scattering diffraction (EBSD)

Funding

  1. Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan [22102006]

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The microstructure and texture evolution of an accumulative roll bonding (ARB) processed 4N-Cu with and without lubrication were compared in addition to the mechanical properties, in order to understand the effect of additional shear strain caused by the friction between the rolls and a sheet. Furthermore, subsequent annealing at 423 K, 448 K and 473 K was applied for 4N-Cu ARB processed with and without lubrication, and, softening was observed for all temperatures. The texture change due to the ARB process and subsequent annealing were discussed using {111} pole figures and ODF maps. As a result, a 45 rotated Cube texture around ND was formed by additional shear strain, whereas the typical fcc rolling texture was formed by ARB with lubrication. At higher ARB cycles of 4N-Cu, discontinuous recrystallization occurs due to its medium stacking fault energy. Cube orientation appeared in annealed-ARB processed 4N-Cu with lubrication, whereas no specific texture appeared in annealed-ARB processed 4N-Cu without lubrication

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