Effect of polyethylene glycol molecular weight on the electrodeposition of nanostructured nickel

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Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

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Nickel electroplating on copper pre-activated Al alloy in the electrolyte containing PEG1000 as an additive

(2018) Jie Guan et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Effect of bath additives on the microstructure, lattice defect density and hardness of electrodeposited nanocrystalline Ni films

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Influence of mode of electrodeposition, current density and saccharin on the microstructure and hardness of electrodeposited nanocrystalline nickel coatings

(2016) Nitin P. Wasekar et al.   SURFACE & COATINGS TECHNOLOGY

A novel method designed for electrodeposition of nanocrystalline Ni coating and its corrosion behaviors in Hank's solution

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Effect of Pulse On-Time and Peak Current Density on Pulse Plated Re-Ni Alloys

(2015) T. Nusbaum et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Modeling the Effects of Different Pulse Current Waveforms on Grain Size of Electrodeposited Nickel Coatings

(2012) Shahram Karimi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microstructure and surface mechanical properties of pulse electrodeposited nickel

(2011) A. Ul-Hamid et al.   APPLIED SURFACE SCIENCE

Influence of polymer additive molecular weight on surface and microstructural characteristics of electrodeposited copper

(2011) R MANU et al.   BULLETIN OF MATERIALS SCIENCE

Effect of Organic Additives on the Hardness of Ni Electrodeposited from Sulfamate and Watt’s Solutions

(2011) Hiroaki Nakano et al.   MATERIALS TRANSACTIONS

Effect of Electroplating Parameters on Microstructure of Nanocrystalline Nickel Coatings

(2010) A.M. Rashidi et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effect of Current Density and Organic Additives on the Texture and Hardness of Ni Electrodeposited from Sulfamate and Watt’s Solutions

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Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects

(2010) L. Yin et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide

(2009) Jongsoo Kim et al.   MATERIALS CHEMISTRY AND PHYSICS

The effect of saccharin addition and bath temperature on the grain size of nanocrystalline nickel coatings

(2009) A.M. Rashidi et al.   SURFACE & COATINGS TECHNOLOGY

Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits

(2007) Yuan Xuetao et al.   SURFACE & COATINGS TECHNOLOGY