X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification

Title
X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification
Authors
Keywords
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Journal
JOURNAL OF TESTING AND EVALUATION
Volume 45, Issue 3, Pages 20150015
Publisher
ASTM International
Online
2016-04-20
DOI
10.1520/jte20150015

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