X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification

标题
X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification
作者
关键词
-
出版物
JOURNAL OF TESTING AND EVALUATION
Volume 45, Issue 3, Pages 20150015
出版商
ASTM International
发表日期
2016-04-20
DOI
10.1520/jte20150015

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