A percolative approach to investigate electromigration failure in printed Ag structures

Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries

(2016) Avinash Mamidanna et al.   ACS Applied Materials & Interfaces

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

(2015) Yousef Farraj et al.   CHEMICAL COMMUNICATIONS

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence

(2015) Simon Gousseau et al.   MICROELECTRONICS RELIABILITY

Long-Term Sustainable Aluminum Precursor Solution for Highly Conductive Thin Films on Rigid and Flexible Substrates

(2014) Hye Moon Lee et al.   ACS Applied Materials & Interfaces

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

(2014) Dong-Hun Shin et al.   ACS Applied Materials & Interfaces

Room-temperature sintering of conductive Ag films on paper

(2014) Qijin Huang et al.   MATERIALS LETTERS

Printed electronics integrated with paper-based microfluidics: new methodologies for next-generation health care

(2014) Gareth Jenkins et al.   Microfluidics and Nanofluidics

Effect of Atomic Interconnects on Percolation in Single-Walled Carbon Nanotube Thin Film Networks

(2014) Xiaojuan Tian et al.   NANO LETTERS

Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

(2014) Yitzchak Rosen et al.   Advanced Materials Interfaces

Reactive Silver Inks for Patterning High-Conductivity Features at Mild Temperatures

(2012) S. Brett Walker et al.   JOURNAL OF THE AMERICAN CHEMICAL SOCIETY

Solution Processed Aluminum Paper for Flexible Electronics

(2012) Hye Moon Lee et al.   LANGMUIR

Conductive Inks with a “Built-In” Mechanism That Enables Sintering at Room Temperature

(2011) Michael Grouchko et al.   ACS Nano

A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film

(2011) Hye Moon Lee et al.   ADVANCED MATERIALS

Inkjet Printing of Low-Temperature Cured Silver Patterns by Using AgNO3/1-Dimethylamino-2-propanol Inks on Polymer Substrates

(2011) Jung-Tang Wu et al.   Journal of Physical Chemistry C

Triggering the Sintering of Silver Nanoparticles at Room Temperature

(2010) Shlomo Magdassi et al.   ACS Nano

Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability

(2010) Shlomo Magdassi et al.   Materials

A low-cure-temperature copper nano ink for highly conductive printed electrodes

(2009) Byoungyoon Lee et al.   CURRENT APPLIED PHYSICS

Current-Density Dependence on Ag eFUSEs With TiN Underlayers

(2009) A. Indluru et al.   IEEE ELECTRON DEVICE LETTERS

Conductive copper and nickel lines via reactive inkjet printing

(2009) Dapeng Li et al.   JOURNAL OF MATERIALS CHEMISTRY

Room temperature preparation of conductive silver features using spin-coating and inkjet printing

(2009) Josué J. P. Valeton et al.   JOURNAL OF MATERIALS CHEMISTRY

Influence of Joule heating during electromigration evaluation of silver lines

(2008) T.L. Alford et al.   THIN SOLID FILMS