Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient

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Title
Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient
Authors
Keywords
Intermetallic compound, Soldering, Diffusion, Growth kinetics, Thermomigration
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 655, Issue -, Pages 155-164
Publisher
Elsevier BV
Online
2015-09-19
DOI
10.1016/j.jallcom.2015.09.151

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