Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation

Title
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
Authors
Keywords
Electrochemical migration (ECM), Numerical simulation, Dendrite, Ion transport, Nernst-Plank equation
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 184, Issue -, Pages 122268
Publisher
Elsevier BV
Online
2021-11-29
DOI
10.1016/j.ijheatmasstransfer.2021.122268

Ask authors/readers for more resources

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now