Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
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Title
Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation
Authors
Keywords
Electrochemical migration (ECM), Numerical simulation, Dendrite, Ion transport, Nernst-Plank equation
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 184, Issue -, Pages 122268
Publisher
Elsevier BV
Online
2021-11-29
DOI
10.1016/j.ijheatmasstransfer.2021.122268
References
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