Electrochemical Migration Inhibition of Tin by Disodium Hydrogen Phosphate in Water Drop Test

Recent advances in method of suppressing dendrite formation of tin-based solder alloys

(2020) Bokai Liao et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers

(2019) Bokai Liao et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

An Arrhenius-type constitutive model to predict the deformation behavior of Sn0.3Ag0.7Cu under different temperature

(2019) Xiaoyan Niu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electrochemical migration behavior of Sn-based lead-free solder

(2019) Xiao Qi et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of crystalline state on conductive filaments forming process in resistive switching memory devices

(2019) Tao Guo et al.   Materials Today Communications

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board

(2018) Pan Yi et al.   BIOELECTROCHEMISTRY

ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

(2018) BOKAI LIAO et al.   SURFACE REVIEW AND LETTERS

Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers

(2018) Bokai Liao et al.   CORROSION SCIENCE

Investigation of Electrochemical Migration of Tin and Tin- Based Lead-Free Solder Alloys under Chloride-Containing Thin Electrolyte Layers

(2018) Shuyi Jiang et al.   International Journal of Electrochemical Science

Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder

(2017) Asit Kumar Gain et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Na2S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions

(2017) Bokai Liao et al.   RSC Advances

Effect of citrate ions on the electrochemical migration of tin in thin electrolyte layer containing chloride ions

(2016) Bokai Liao et al.   CORROSION SCIENCE

Test methods for electrochemical migration: a review

(2016) Xiankang Zhong et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

(2016) Nana Amponsah Kyeremateng et al.   Nature Nanotechnology

The effect of electrolyte layer thickness on electrochemical migration of tin

(2015) Xiankang Zhong et al.   CORROSION SCIENCE

Dissolution properties of cerium dibutylphosphate corrosion inhibitors

(2013) M van Soestbergen et al.   CORROSION ENGINEERING SCIENCE AND TECHNOLOGY

Electrochemical migration of tin in thin electrolyte layer containing chloride ions

(2013) Xiankang Zhong et al.   CORROSION SCIENCE

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

(2013) Shiwen Zou et al.   ELECTROCHIMICA ACTA

Phosphate ions as corrosion inhibitors for reinforcement steel in chloride-rich environments

(2013) L. Yohai et al.   ELECTROCHIMICA ACTA

In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field

(2013) Xiankang Zhong et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Cyclic voltammetry study of passivation of tin in sodium dihydrogen phosphate solution

(2012) N. A. Al-Mobarak   CHEMISTRY AND TECHNOLOGY OF FUELS AND OILS

On the electrochemical migration mechanism of tin in electronics

(2011) Daniel Minzari et al.   CORROSION SCIENCE

Inkjet printed electronics using copper nanoparticle ink

(2010) Jin Sung Kang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Environmental factors affecting the corrosion behavior of reinforcing steel II. Role of some anions in the initiation and inhibition of pitting corrosion of steel in Ca(OH)2 solutions

(2009) S.M. Abd El Haleem et al.   CORROSION SCIENCE