Revealing the acceleration effect of SPS and Cl - on copper Surface: Instantaneous nucleation and Multi-Step energy change

Synergically engineering defect and interlayer in SnS2 for enhanced room-temperature NO2 sensing

(2021) Quan Sun et al.   JOURNAL OF HAZARDOUS MATERIALS

CP2K: An electronic structure and molecular dynamics software package - Quickstep: Efficient and accurate electronic structure calculations

(2020) Thomas D. Kühne et al.   JOURNAL OF CHEMICAL PHYSICS

Ionization of Water as an Effect of Quantum Delocalization at Aqueous Electrode Interfaces

(2020) Jinggang Lan et al.   Journal of Physical Chemistry Letters

Electrodeposition of Copper Metal from the 1-Ethyl-3-methylimidazolium Fluoride ([EMIM]F)-urea-H2O System Containing Cu2O

(2020) Wencai HE et al.   ELECTROCHEMISTRY

Trans-interface-diffusion-controlled coarsening of γ′ particles in Ni–Al alloys: commentaries and analyses of recent data

(2020) Alan J. Ardell   JOURNAL OF MATERIALS SCIENCE

Electrochemistry-enabled atomic layer deposition of copper: Investigation of the deposit growth rate and roughness

(2019) Kailash Venkatraman et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

In situ probing electrified interfacial water structures at atomically flat surfaces

(2019) Chao-Yu Li et al.   NATURE MATERIALS

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

(2018) D. Josell et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

(2018) Chaohui Liao et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Electroless Copper Plating Process by Applying Alternating One-Side Air Stirring Method for High-Aspect-Ratio Through-Holes

(2017) H. Kanemoto et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition

(2017) Byoungyong Im et al.   THIN SOLID FILMS

Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

(2016) Tzu-Chi Chen et al.   ELECTROCHIMICA ACTA

Adsorption of adenine on the surface of nickel-decorated graphene; A DFT study

(2016) Sara Gholami et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

(2015) Yu Chang et al.   ELECTROCHIMICA ACTA

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

(2013) Xuelian Li et al.   ANALYTICA CHIMICA ACTA

Alternant conjugated oligomers with tunable and narrow HOMO–LUMO gaps as sustainable nanowires

(2013) Sergio Manzetti et al.   RSC Advances

Periodic Pulse Reverse Cu Plating for Through-Hole Filling

(2013) F.-Y. Shen et al.   ECS Electrochemistry Letters

Printed circuit board technology inspired stretchable circuits

(2012) J. Vanfleteren et al.   MRS BULLETIN

NIH Image to ImageJ: 25 years of image analysis

(2012) Caroline A Schneider et al.   NATURE METHODS

Effects of supporting electrolytes on copper electroplating for filling through-hole

(2011) Chien-Hung Chen et al.   ELECTROCHIMICA ACTA

Microfluidic chips for capillary electrophoresis with integrated electrodes for capacitively coupled conductivity detection based on printed circuit board technology

(2011) Rosanne M. Guijt et al.   SENSORS AND ACTUATORS B-CHEMICAL

Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

(2010) Wei-Ping Dow et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Influence of additives and pulse parameters on uniformity of through-hole copper plating

(2010) Z.X. Wang et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Reaction and nucleation mechanisms of copper electrodeposition on disposable pencil graphite electrode

(2008) M.R. Majidi et al.   ELECTROCHIMICA ACTA

Through-Hole Filling by Copper Electroplating

(2008) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY