Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC

Title
Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC
Authors
Keywords
Ultrasonic vibration assisted polishing, Micro cylindrical surface, Silicon Carbide (SiC), Material removal mechanism, Friction behavior, Abrasion behavior
Journal
Publisher
Elsevier BV
Online
2016-01-16
DOI
10.1016/j.ijmachtools.2016.01.003

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