Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC

标题
Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC
作者
关键词
Ultrasonic vibration assisted polishing, Micro cylindrical surface, Silicon Carbide (SiC), Material removal mechanism, Friction behavior, Abrasion behavior
出版物
出版商
Elsevier BV
发表日期
2016-01-16
DOI
10.1016/j.ijmachtools.2016.01.003

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