Grain boundary engineering in roll-bonded copper to overcome the strength-ductility dilemma

Title
Grain boundary engineering in roll-bonded copper to overcome the strength-ductility dilemma
Authors
Keywords
Pure copper, Heterostructured materials, Gradient microstructures, Strain delocalization
Journal
Publisher
Elsevier BV
Online
2022-02-17
DOI
10.1016/j.jmrt.2022.02.032

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