Study of ion transportation and electrodeposition under hybrid agitation for electroforming of variable aspect ratios micro structures

Advances in precision micro/nano-electroforming: A state of the art review

(2020) Honggang Zhang et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Synergistic effect of surfactant and saccharin on dispersion and crystal refinement for electrodeposition of nanocrystalline nickel/graphene oxide composite

(2020) Honggang Zhang et al.   SURFACE & COATINGS TECHNOLOGY

The key role of suppressor diffusion in defect-free filling of the through-silicon-via with high depth

(2019) Feng Wang et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Effect of cetyl-trimethyl-ammonium-bromide (CTAB) and bis (3-sulfopropyl) disulfide (SPS) on the through-silicon-via (TSV) copper filling

(2019) Fuliang Wang et al.   MICROELECTRONIC ENGINEERING

Fabrication of high-performance nickel/graphene oxide composite coatings using ultrasonic-assisted electrodeposition

(2019) Honggang Zhang et al.   ULTRASONICS SONOCHEMISTRY

Effect of via depth on the TSV filling process for different current densities

(2018) Feng Wang et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Effects of pulse reverse electroforming parameters on the thickness uniformity of electroformed copper foil

(2018) Quoc-Dinh Cao et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Quantitative study of mass transfer in megasonic micro electroforming based on mass transfer coefficient: Simulation and experimental validation

(2018) Ming Zhao et al.   ELECTROCHIMICA ACTA

High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition

(2017) Fuliang Wang et al.   MICROELECTRONIC ENGINEERING

Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities

(2017) Fuliang Wang et al.   Scientific Reports

Numerical simulation of electro-deposition process influenced by force convection and migration of ions

(2016) M. Zahraei et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition

(2016) M. T. Johnson et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Simulation and fabrication of two Cu TSV electroplating methods for wafer-level 3D integrated circuits packaging

(2013) Shuai Shi et al.   SENSORS AND ACTUATORS A-PHYSICAL

Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming process

(2012) Jungjin Han et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Two-dimensional simulations of ion concentration distribution in microstructural electroforming

(2011) Tsung-Hsun Tsai et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Micro-electroforming under periodic vacuum-degassing and temperature-gradient conditions

(2009) P.M. Ming et al.   VACUUM

Research on bipolar pulse current electroforming in precision molds and dies

(2009) Hongyou Li et al.   TSINGHUA SCIENCE AND TECHNOLOGY

Fabricating HARMS by using megasonic assisted electroforming

(2008) Gang Liu et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS