Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement

Title
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement
Authors
Keywords
PV reliability, Solder joint degradation, Thermal cycling, Cell power drop, Finite element analysis
Journal
MICROELECTRONICS RELIABILITY
Volume 127, Issue -, Pages 114399
Publisher
Elsevier BV
Online
2021-10-04
DOI
10.1016/j.microrel.2021.114399

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