4.6 Article

Thermal stability of gradient microstructure in a low-alloyed Cu-Cr-Zr alloy

Journal

MATERIALS LETTERS
Volume 304, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.matlet.2021.130531

Keywords

Copper alloys; Thermal stability; Recrystallization; Electron microscopy

Funding

  1. Russian Science Foundation (RSF) [19-79-30025]

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The thermal stability of gradient microstructures in a Cu-Cr-Zr alloy subjected to ECAP was studied, showing that an increase in ECAP passes led to a decrease in recrystallization temperature. The influence of deformation microstructures and particle precipitation on recrystallization development was also discussed in the study.
The thermal stability of gradient microstructures in a Cu - 0.096%Cr - 0.07%Zr (wt.%) alloy subjected to equal channel angular pressing (ECAP) at 400 degrees C was studied. The microstructure after intense plastic straining and aging at 300-500 degrees C was almost the same. Aging at 600 degrees C led to the development of a partially recrystallized microstructure. After aging at 700 degrees C, the fully recrystallized microstructure evolved. An increase in ECAP passes from 1 to 12 decreased the recrystallization temperature from 664 degrees C to 617 degrees C. The effect of deformation microstructures and particle precipitation on the recrystallization development is discussed.

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