Microstructure evolution and anti-wear mechanism of Cu film fabricated by magnetron sputtering deposition

Copper (Cu) film was fabricated by magnetron sputtering method, and then subjected to current-carrying friction experiments in this study. Plastic deformations were found in the surface of the wear scar. Focused Ion Beam (FIB) cutting technology was firstly used combined with the Electron Backscattered Diffraction (EBSD) to analyze the worn surface, and the results indicated that the original grains would be broken down into smaller grains during friction. Owing to the strengthening effect of grain refinement, the Cu film exhibited good anti-wear properties. The TEM pattern revealed that the Cu Columnar crystals grow along the direction of magnetron sputtering deposition and perpendicular to the direction of reciprocating friction. GP zones and Nano-twins were observed at the polar surface, and the GP zones would gradually transform to stacking faults structures during the friction.

Automated summary

Copper film was fabricated by magnetron sputtering method and subjected to friction experiments. Focused Ion Beam cutting technology combined with Electron Backscattered Diffraction analysis showed that the original grains would be broken down into smaller grains during friction. The grain refinement effect resulted in good anti-wear properties of the Cu film.