Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study

Silver Tarnishing Mechanism Revealed by Molecular Dynamics Simulations

(2019) Gabriele Saleh et al.   ANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Oxygen and sulfur adsorption on vicinal surfaces of copper and silver: Preferred adsorption sites

(2018) Da-Jiang Liu et al.   JOURNAL OF CHEMICAL PHYSICS

Review of silver nanoparticle based die attach materials for high power/temperature applications

(2017) Seyed Amir Paknejad et al.   MICROELECTRONICS RELIABILITY

A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

(2016) Yongjun Huo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Structures and Acidity Constants of Silver–Sulfide Complexes in Hydrothermal Fluids: A First-Principles Molecular Dynamics Study

(2016) Mengjia He et al.   JOURNAL OF PHYSICAL CHEMISTRY A

The ReaxFF reactive force-field: development, applications and future directions

(2016) Thomas P Senftle et al.   npj Computational Materials

Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste

(2015) Tomoyuki Fujimoto et al.   MATERIALS TRANSACTIONS

Influence of relative humidity and ozone on atmospheric silver corrosion

(2013) R. Wiesinger et al.   CORROSION SCIENCE

Micro-Raman investigations of early stage silver corrosion products occurring in sulfur containing atmospheres

(2013) I. Martina et al.   JOURNAL OF RAMAN SPECTROSCOPY

Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications

(2012) Hui Yu et al.   SCRIPTA MATERIALIA

Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37

(2011) Bálint Medgyes et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Selective Oxidation and the Third-Element Effect on the Oxidation of Mg-Y Alloys at High Temperatures

(2009) J.F. Fan et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool

(2009) Alexander Stukowski   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

(2008) Hongqin Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

(2007) Abhijit Kar et al.   MATERIALS LETTERS