Fabrication and characterization of ultra-thin vapour chambers with printed copper powder wick
Published 2021 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Fabrication and characterization of ultra-thin vapour chambers with printed copper powder wick
Authors
Keywords
Screen printing, Copper powder, Ultra-thin vapour chamber, Electronic cooling
Journal
APPLIED THERMAL ENGINEERING
Volume 201, Issue -, Pages 117734
Publisher
Elsevier BV
Online
2021-10-30
DOI
10.1016/j.applthermaleng.2021.117734
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Recent advances in the optimization of evaporator wicks of vapor chambers: from mechanism to fabrication technologies
- (2021) Xin Cheng et al. APPLIED THERMAL ENGINEERING
- Microstructured wettability pattern for enhancing thermal performance in an ultrathin vapor chamber
- (2021) Yinchuang Yang et al. Case Studies in Thermal Engineering
- Facile fabrication of multi-scale microgroove textures on Ti-based surface by coupling the re-solidification bulges derived from nanosecond laser irradiation
- (2020) Haidong He et al. SURFACE & COATINGS TECHNOLOGY
- A novel ultra-large flat plate heat pipe manufactured by thermal spray
- (2020) C. Feng et al. APPLIED THERMAL ENGINEERING
- Co-designing electronics with microfluidics for more sustainable cooling
- (2020) Remco van Erp et al. NATURE
- Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices
- (2019) Zhaoshu Chen et al. ENERGY CONVERSION AND MANAGEMENT
- Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber
- (2019) Bo Shi et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Effect of the passage area ratio of liquid to vapor on an ultra-thin flattened heat pipe
- (2019) Wenjie Zhou et al. APPLIED THERMAL ENGINEERING
- Fabrication and thermal performance of mesh-type ultra-thin vapor chambers
- (2019) Guangwen Huang et al. APPLIED THERMAL ENGINEERING
- A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices
- (2019) Guangwen Huang et al. APPLIED THERMAL ENGINEERING
- Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips
- (2019) Ji Li et al. ENERGY CONVERSION AND MANAGEMENT
- Ultra-thin flattened heat pipe with a novel band-shape spiral woven mesh wick for cooling smartphones
- (2019) Wenjie Zhou et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
- (2018) Heng Tang et al. APPLIED ENERGY
- Fabrication and characterization of pure-metal-based submillimeter-thick flexible flat heat pipe with innovative wick structures
- (2018) Daehoon Lee et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Thermal performance of the flat micro-heat pipe with the wettability gradient surface by laser fabrication
- (2018) Xiaozhu Xie et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
- (2018) Nan Wang et al. Small
- A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices
- (2018) Wenjie Zhou et al. ENERGY CONVERSION AND MANAGEMENT
- Comparative thermal performance evaluation between ultrathin flat plate pulsating heat pipe and graphite sheet for mobile electronic devices at various operating conditions
- (2018) Dong Soo Jang et al. APPLIED THERMAL ENGINEERING
- Thermal performance evaluation of thin vapor chamber
- (2018) S.W. Chang et al. APPLIED THERMAL ENGINEERING
- Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices
- (2017) Mohammad Shahed Ahamed et al. HEAT AND MASS TRANSFER
- A novel oxidized composite braided wires wick structure applicable for ultra-thin flattened heat pipes
- (2017) Kai-Shing Yang et al. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER
- Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
- (2017) Steven A. Isaacs et al. JOURNAL OF ELECTRONIC PACKAGING
- Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays
- (2017) Rongfu Wen et al. Nano Energy
- Development and characterization of a flat laminate vapor chamber
- (2016) Kei Mizuta et al. APPLIED THERMAL ENGINEERING
- Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
- (2016) Li-Anne Liew et al. JOURNAL OF ELECTRONIC PACKAGING
- Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure
- (2016) Shanshan Xu et al. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
- Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization
- (2015) Ryan Lewis et al. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
- Microfabricated ultra-thin all-polymer thermal ground planes
- (2015) Ryan Lewis et al. Science Bulletin
- Performance and two-phase flow pattern for micro flat heat pipes
- (2014) Kai-Shing Yang et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Thermal performance of a flat polymer heat pipe heat spreader under high acceleration
- (2012) Christopher Oshman et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- A Flat Heat Pipe Architecture Based on Nanostructured Titania
- (2010) Changsong Ding et al. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started