Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling

Comprehensive thermal resistance model of forced air cooling system for multiple power chips

(2021) Hongyi Lin et al.   Energy Reports

Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation

(2021) Yuxin Ye et al.   APPLIED THERMAL ENGINEERING

A novel composite pinfin heat sink for hotspot mitigation

(2020) Danish Ansari et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Temperature Uniformity Enhancement and Flow Characteristics of Embedded Gradient Distribution Micro Pin Fin Arrays Using Dielectric Coolant for Direct Intra-Chip Cooling

(2020) Shuai Feng et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Study on Degradation Mechanisms of Thermal Conductivity for Confined Nanochannel in Gate-All-Around Silicon Nanowire Field-Effect Transistors

(2020) Junhua Lai et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Co-designing electronics with microfluidics for more sustainable cooling

(2020) Remco van Erp et al.   NATURE

Theoretical and numerical investigation of embedded microfluidic thermal management using gradient distribution micro pin fin arrays

(2019) Shuai Feng et al.   APPLIED THERMAL ENGINEERING

A novel thermal management scheme for 3D-IC chips with multi-cores and high power density

(2019) Bin Ding et al.   APPLIED THERMAL ENGINEERING

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

(2018) Kevin P. Drummond et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

A fast and accurate temperature prediction method for microfluidic cooling with multiple distributed hotspots

(2018) Yudan Pi et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

(2018) Ki Wook Jung et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

1D and Q2D thermal resistance analysis of micro channel structure and flat plate heat pipe

(2017) Shao-Wen Chen et al.   MICROELECTRONICS RELIABILITY

Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps

(2017) Thomas E. Sarvey et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering

(2016) Daniel Lorenzini et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Review of Advances in Thermal Spreading Resistance Problems

(2016) M. Razavi et al.   JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER

A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study

(2015) Chander Shekhar Sharma et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot

(2015) Abas Abdoli et al.   INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink—An Experimental Study

(2013) Yong Jiun Lee et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

AlGaN/GaN HEMT With Distributed Gate for Channel Temperature Reduction

(2012) Ali M. Darwish et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

(2010) W. Escher et al.   JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME

Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

(2009) Craig Green et al.   JOURNAL OF ELECTRONIC PACKAGING