Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing

Double-sided and single-sided polished 6H-SiC wafers with subsurface damage layer studied by Mueller matrix ellipsometry

(2020) Huihui Li et al.   JOURNAL OF APPLIED PHYSICS

New Insight on the Interface between Polythiophene and Semiconductors via Molecular Dynamics Simulations

(2019) Yicheng Qian et al.   ACS Applied Materials & Interfaces

Study on nanomechanical properties of 4H-SiC and 6H-SiC by molecular dynamics simulations

(2019) Zige Tian et al.   CERAMICS INTERNATIONAL

Advances in ultra-precision machining of micro-structured functional surfaces and their typical applications

(2019) Shaojian Zhang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Molecular dynamics simulation of silicon carbide nanoscale material removal behavior

(2018) Yao Liu et al.   CERAMICS INTERNATIONAL

Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

(2018) Yongchao Xu et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

In situ atomic-scale observation of monolayer graphene growth from SiC

(2018) Kaihao Yu et al.   Nano Research

Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions

(2018) Lei Chen et al.   Nature Communications

Thermal Transport across SiC–Water Interfaces

(2018) C. Ulises Gonzalez-Valle et al.   ACS Applied Materials & Interfaces

A molecular dynamics study on atomistic mechanisms of nano-scale cutting process of sapphire

(2017) Woo Kyun Kim et al.   Journal of Mechanical Science and Technology

Removal mechanism of 4H- and 6H-SiC substrates (0001 and 0001¯) in mechanical planarization machining

(2017) Jing Lu et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools

(2016) Q.F. Luo et al.   WEAR

The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad

(2015) Jing Lu et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

(2015) Yan Zhou et al.   TRIBOLOGY INTERNATIONAL

Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets

(2014) Zhichao Dong et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

The current understanding on the diamond machining of silicon carbide

(2014) Saurav Goel   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Hydrogenation of the buffer-layer graphene on 6H-SiC (0001): A possible route for the engineering of graphene-based devices

(2014) Yu-Pu Lin et al.   Nano Research

Extended study of the atomic step-terrace structure on hexagonal SiC (0001) by chemical-mechanical planarization

(2013) Xiaolei Shi et al.   APPLIED SURFACE SCIENCE

Flow behavior, thixotropy and dynamical viscoelasticity of sodium alginate aqueous solutions

(2013) Junyi Ma et al.   FOOD HYDROCOLLOIDS

The development of a surface defect machining method for hard turning processes

(2013) Waleed Bin Rashid et al.   WEAR

A quantitative assessment of nanometric machinability of major polytypes of single crystal silicon carbide

(2012) Xichun Luo et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

On the mechanism of material removal by fixed abrasive lapping of various glass substrates

(2012) Byoung-Jun Cho et al.   WEAR

Deconfinement leads to changes in the nanoscale plasticity of silicon

(2011) Dariusz Chrobak et al.   Nature Nanotechnology

In situ monitoring and depth-resolved characterization of wet wear of silicon carbide

(2011) V. Presser et al.   WEAR

Atomistic aspects of ductile responses of cubic silicon carbide during nanometric cutting

(2011) Saurav Goel et al.   Nanoscale Research Letters

Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)

(2010) H.S. Lee et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

(2009) Mahadevaiyer Krishnan et al.   CHEMICAL REVIEWS

Raman Spectra of Epitaxial Graphene on SiC and of Epitaxial Graphene Transferred to SiO2

(2008) Dong Su Lee et al.   NANO LETTERS