4.6 Article

A rigid cylinder of a thermoelastic magnetic semiconductor material based on the generalized Moore-Gibson-Thompson heat equation model

Journal

Publisher

SPRINGER HEIDELBERG
DOI: 10.1007/s00339-021-05240-y

Keywords

MGTPT thermoelasticity; Semiconductor; Materials; Solid cylinder; Pulsed heating

Funding

  1. Deanship of Scientific Research at Jouf University [DSR-2021-03-0211]

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This study introduces a new generalized photothermal model, which can be used to investigate the thermo-optical transition process and the interaction between elastic plasma waves and heat. By studying the thermal and photoacoustic effects in a solid cylinder of semiconductor material subjected to a fixed magnetic field and high-intensity laser heat flux, numerical expressions for thermal stresses, displacement, temperature field, and carrier density are derived using the Laplace transform technique. The study analyzes the propagation of thermal, elastic, and plasma waves, as well as the distributions of each studied field. The comparison also evaluates the impact of thermoelastic response characteristics on the photo-thermoelastic response.
The current study aims to introduce a new generalized photothermal model in which heat equation is described based on the Moore-Gibson-Thompson (MGT) equation. The thermo-optical transition process can be understood, and the interaction between elastic plasma waves and heat can be investigated and explained using the suggested model. The proposed model was used to investigate the thermal and photoacoustic effects in an infinitely constrained solid cylinder of semiconductor material that was crossed into a fixed magnetic field and subjected to a high-intensity laser heal flux. The Laplace transform technique is used to derive the numerical expressions for the components of thermal stresses, displacement, temperature field, and carrier density. The propagation of thermal, elastic, and plasma waves, as well as the distributions of each studied field, was investigated and described. The comparison is also used to evaluate the impact of thermoelastic response characteristics such as thermal relaxations, temperature frequency, and lifetime on the photo-thermoelastic response.

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