Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers

Published 2021 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
Authors
Keywords
-
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 11, Issue 8, Pages 1177-1186
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2021-06-23
DOI
10.1109/tcpmt.2021.3091555

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.