An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

(2020) Liyuan Wang et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

(2019) Lixiang Zhang et al.   CURRENT APPLIED PHYSICS

Experimental and numerical investigation of high velocity soft impact loading on aircraft materials

(2019) J. Zhou et al.   AEROSPACE SCIENCE AND TECHNOLOGY

Simulation and experimental research on subsurface damage of silicon nitride grinding

(2018) Linlin Wan et al.   CERAMICS INTERNATIONAL

The possibility of performing FEA analysis of a contact loading process fed by the MD simulation data

(2018) Saurav Goel et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

(2017) Tengyun Liu et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon

(2017) Hao Nan Li et al.   MATERIALS & DESIGN

Influence of microstructure on the cutting behaviour of silicon

(2016) Saurav Goel et al.   ACTA MATERIALIA

Strain rate-sensitive analysis for grinding damage of brittle materials

(2016) Chongjun Wu et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

A predictive model of grinding force in silicon wafer self-rotating grinding

(2016) Jinglong Sun et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Molecular dynamics simulation study of deformation mechanisms in 3C–SiC during nanometric cutting at elevated temperatures

(2016) Saeed Zare Chavoshi et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Experiment study on electroplated diamond wire saw slicing single-crystal silicon

(2016) Yufei Gao et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Dislocation-mediated plasticity in silicon during nanometric cutting: A molecular dynamics simulation study

(2016) Saeed Zare Chavoshi et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Simulation-based evaluation of surface micro-cracks and fracture toughness in high-speed grinding of silicon carbide ceramics

(2015) Yao Liu et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

(2015) Changchu Wang et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Diamond machining of silicon: A review of advances in molecular dynamics simulation

(2015) Saurav Goel et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Investigations of critical cutting speed and ductile-to-brittle transition mechanism for workpiece material in ultra-high speed machining

(2015) Bing Wang et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Strain-rate sensitivity of glasses

(2014) Rene Limbach et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

On the cracks self-healing mechanism at ductile mode cutting of silicon

(2014) A.M. Kovalchenko et al.   TRIBOLOGY INTERNATIONAL

Study on the system matching of ultrasonic vibration assisted grinding for hard and brittle materials processing

(2013) Yan Wang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Elastic–plastic spherical indentation: Deformation regimes, evolution of plasticity, and hardening effect

(2013) Z. Song et al.   MECHANICS OF MATERIALS

A model for nanogrinding based on direct evidence of ground chips of silicon wafers

(2013) ZhenYu Zhang et al.   Science China-Technological Sciences

Effect of temperature, strain, and strain rate on the flow stress of aluminum under shock-wave compression

(2012) E. B. Zaretsky et al.   JOURNAL OF APPLIED PHYSICS

A quantitative assessment of nanometric machinability of major polytypes of single crystal silicon carbide

(2012) Xichun Luo et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Orientation and rate dependence in high strain-rate compression of single-crystal silicon

(2012) R. F. Smith et al.   PHYSICAL REVIEW B

Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding

(2010) Yaguo Li et al.   APPLIED SURFACE SCIENCE

A different type of indentation size effect

(2008) S. Shim et al.   SCRIPTA MATERIALIA