Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances

Published 2020 View Full Article

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Title
Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances
Authors
Keywords
-
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 11, Issue 3, Pages 493-503
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2020-12-31
DOI
10.1109/tcpmt.2020.3048155

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