Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

Numerical investigation of laminar flow and heat transfer in a liquid metal cooled mini-channel heat sink

(2020) Adeel Muhammad et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

(2020) Jooyoung Lee et al.   APPLIED THERMAL ENGINEERING

A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications

(2020) Seokkan Ki et al.   INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Millefeuille-Inspired Thermally Conductive Polymer Nanocomposites with Overlapping BN Nanosheets for Thermal Management Applications

(2019) Jin Chen et al.   ACS Applied Materials & Interfaces

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

(2019) Wen Dai et al.   ACS Nano

Oxide‐Mediated Formation of Chemically Stable Tungsten–Liquid Metal Mixtures for Enhanced Thermal Interfaces

(2019) Wilson Kong et al.   ADVANCED MATERIALS

Metallic Bond-Enabled Wetting Behavior at the Liquid Ga/CuGa2 Interfaces

(2018) Yuntao Cui et al.   ACS Applied Materials & Interfaces

In Situ Alloying of Thermally Conductive Polymer Composites by Combining Liquid and Solid Metal Microadditives

(2018) Matthew I. Ralphs et al.   ACS Applied Materials & Interfaces

Wrinkling Instability and Adhesion of a Highly Bendable Gallium Oxide Nanofilm Encapsulating a Liquid-Gallium Droplet

(2018) Muhammad Yunusa et al.   NANO LETTERS

Band alignments at Ga2O3 heterojunction interfaces with Si and Ge

(2018) J. T. Gibbon et al.   AIP Advances

Effect of Contact Pressure on the Performance of Carbon Nanotube Arrays Thermal Interface Material

(2018) Yu Pei et al.   Nanomaterials

Enhanced heat transfer using metal foam liquid supply layers for micro heat spreaders

(2017) Seunggeol Ryu et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Thermal performance of low melting temperature alloys at the interface between dissimilar materials

(2016) Chandan K. Roy et al.   APPLIED THERMAL ENGINEERING

Metallic nanoemulsion with galinstan for high heat-flux thermal management

(2016) Yoshikazu Hayashi et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

The chips are down for Moore’s law

(2016) M. Mitchell Waldrop   NATURE

Comparative toxicity and biodistribution assessments in rats following subchronic oral exposure to copper nanoparticles and microparticles

(2016) In-Chul Lee et al.   Particle and Fibre Toxicology

Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma

(2015) Zheng Guo et al.   CHEMISTRY OF MATERIALS

Investigation into the application of low melting temperature alloys as wet thermal interface materials

(2015) Chandan K. Roy et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Enhancing the effectiveness of silicone thermal grease by the addition of functionalized carbon nanotubes

(2013) Hongyuan Chen et al.   APPLIED SURFACE SCIENCE

Effect of Microtextured Surface Topography on the Wetting Behavior of Eutectic Gallium–Indium Alloys

(2013) Rebecca K. Kramer et al.   LANGMUIR

Gallium-based thermal interface material with high compliance and wettability

(2012) Yunxia Gao et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Development of high-temperature solders: Review

(2012) Guang Zeng et al.   MICROELECTRONICS RELIABILITY

Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials

(2012) Khan M. F. Shahil et al.   NANO LETTERS

A Three-Dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-Based Thermal Interfacial Materials

(2011) Qizhen Liang et al.   ACS Nano

Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films

(2010) Matthew A. Panzer et al.   NANO LETTERS

Experimental Investigation of Heat Conduction Mechanisms in Nanofluids. Clue on Clustering

(2009) J. W. Gao et al.   NANO LETTERS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids

(2008) William Evans et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Superior Thermal Conductivity of Single-Layer Graphene

(2008) Alexander A. Balandin et al.   NANO LETTERS