Journal
IEEE ELECTRON DEVICE LETTERS
Volume 42, Issue 4, Pages 477-480Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2021.3057917
Keywords
Lateral GaN Schottky barrier diode; tungsten anode; current collapse; thick GaN cap layer
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Funding
- National Key Science and Technology Special Project [2017ZX01001301]
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This letter demonstrates a high-performance lateral AIGaN/GaN Schottky barrier diode featuring low turn-on voltage and high breakdown voltage, achieved by using a low work-function tungsten layer and a thick GaN cap layer. The device shows impressive stability in dynamic on-resistance and turn-on voltage under long-duration stress tests, indicating great potential for next-generation power electronic devices.
In this letter, we demonstrate a high-performance lateral AIGaN/GaN Schottky barrier diode (SBD) using an 80-nm thick GaN cap layer as the passivation layer and a low work-function tungsten (W) layer as the anode. A low turn-on voltage (V-ON) of 0.38 V and a high breakdown voltage of 2.08 kV are obtained at the same time. Additionally, the normalized dynamic on-resistance (R-ON,R-dyn) becomes only a factor of 1.13 higher than the static on-resistance (R-ON) after a 10-s-long bias test at 900 V. Also owing to the impressively stability of R-ON,R-dyn and V-ON under long-duration stress, these lateral GaN SBDs with a thick GaN cap layer show a great potential for the next-generation of power electronic devices.
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