Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

Title
Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling
Authors
Keywords
Electrodeposited copper, Self-consistent scheme, Elasto-viscoplasticity, Kinematic hardening, Experiments
Journal
MECHANICS OF MATERIALS
Volume 153, Issue -, Pages 103685
Publisher
Elsevier BV
Online
2020-12-01
DOI
10.1016/j.mechmat.2020.103685

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