Effects of organic additives on the impurity and grain structure of electrodeposited cobalt

Oscillatory Behavior in Cobalt Electrodeposition with 3-Mercapto-1-Propanesulfonate

(2020) Y. Hu et al.   Journal of Physical Chemistry C

The Many “Facets” of Halide Ions in the Chemistry of Colloidal Inorganic Nanocrystals

(2018) Sandeep Ghosh et al.   CHEMICAL REVIEWS

Effects of Dimethylglyoxime and Cyclohexane Dioxime on the Electrochemical Nucleation and Growth of Cobalt

(2018) Y. Hu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization

(2018) J. Kelly et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electron mean free path in elemental metals

(2016) Daniel Gall   JOURNAL OF APPLIED PHYSICS

Electrodeposition of Cobalt for Interconnect Application: Effect of Dimethylglyoxime

(2016) Q. Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Impurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives

(2014) Q. Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects

(2012) J. Kelly et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Catalytic hydrogen evolution from a covalently linked dicobaloxime

(2012) C. N. Valdez et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Characterization of Electrodeposited Copper Films with Time-of-Flight SIMS

(2009) H Demers et al.   MICROSCOPY AND MICROANALYSIS

Cobalt and nickel diimine-dioxime complexes as molecular electrocatalysts for hydrogen evolution with low overvoltages

(2009) P.-A. Jacques et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines

(2008) M. Stangl et al.   THIN SOLID FILMS

Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)

(2007) M. Stangl et al.   MICROELECTRONIC ENGINEERING