Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization

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Electrodeposition of Cobalt for Interconnect Application: Effect of Dimethylglyoxime

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Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias

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Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations

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Size-Dependent Resistivity in Nanoscale Interconnects

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Microstructure and magnetic properties of electrodeposited cobalt films

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