A modified 360 o netting vein bionic structure for enhancing thermal properties of Polymer/Nanofiber/Nanoparticle composite

Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties

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Graphene interlayer for enhanced interface thermal conductance in metal matrix composites: An approach beyond surface metallization and matrix alloying

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Enhanced strength and ductility in a high-entropy alloy via ordered oxygen complexes

(2018) Zhifeng Lei et al.   NATURE

Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops

(2017) Yunna Sun et al.   MICROELECTRONICS RELIABILITY

Fabrication of polymer nanocomposites via ball milling: Present status and future perspectives

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A review of recent developments in natural fibre composites and their mechanical performance

(2016) K.L. Pickering et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

Improved performances of AlN/polyimide hybrid film and its application in redistribution layer

(2016) Zhe Liu et al.   Electronic Materials Letters

A complex reinforced polymer interposer with ordered Ni grid and SiC nano-whiskers polyimide composite based on micromachining technology

(2016) Yanmei Liu et al.   Electronic Materials Letters

Through-silicon via-induced strain distribution in silicon interposer

(2015) B. Vianne et al.   APPLIED PHYSICS LETTERS

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

(2015) Wen Dai et al.   COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

(2014) John H. Lau   JOURNAL OF ELECTRONIC PACKAGING

Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

(2014) Yang Zhang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

QUANTIFICATION AND THE UNDERLYING MECHANISM OF SKIN THERMAL DAMAGE: A REVIEW

(2010) F. XU et al.   Journal of Mechanics in Medicine and Biology

Improved thermal conductivity of epoxy composites using a hybrid multi-walled carbon nanotube/micro-SiC filler

(2009) Tianle Zhou et al.   CARBON

Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids

(2008) William Evans et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER