Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties

Published 2019 View Full Article

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Title
Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties
Authors
Keywords
Metal matrix composites (MMCs), Nearly void-free, Near-perfect interfaces, Electroplating, Microstructure, Thermal properties
Journal
MATERIALS CHARACTERIZATION
Volume 150, Issue -, Pages 199-206
Publisher
Elsevier BV
Online
2019-02-20
DOI
10.1016/j.matchar.2019.02.018

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