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Title
On coupling contact analysis of thermoelectric materials
Authors
Keywords
Seebeck effect, Punch, Closed-form solution, Surface contact stress, Intensity factors
Journal
APPLIED MATHEMATICAL MODELLING
Volume 89, Issue -, Pages 1459-1474
Publisher
Elsevier BV
Online
2020-08-18
DOI
10.1016/j.apm.2020.08.024
References
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