标题
On coupling contact analysis of thermoelectric materials
作者
关键词
Seebeck effect, Punch, Closed-form solution, Surface contact stress, Intensity factors
出版物
APPLIED MATHEMATICAL MODELLING
Volume 89, Issue -, Pages 1459-1474
出版商
Elsevier BV
发表日期
2020-08-18
DOI
10.1016/j.apm.2020.08.024
参考文献
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