4.6 Article

Microstructure and thermal conductivity of Si-Al-C-O fiber bonded ceramics joined to refractory metals

Journal

MATERIALS LETTERS
Volume 276, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.matlet.2020.128203

Keywords

Silicon carbide; Ceramics; Thermal conductivity; Joining

Funding

  1. Spanish MINECO [MAT2016-76526-R]
  2. FPU program of the Spanish Ministerio de Educacion, Cultura y Deporte

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We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 degrees C and times in the range of 10-20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1-2 mu m thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect (C) 2020 Elsevier B.V. All rights reserved.

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