A Review of Thermo-Hydraulic Performance of Metal Foam and its Application as Heat Sinks for Electronics Cooling

Title
A Review of Thermo-Hydraulic Performance of Metal Foam and its Application as Heat Sinks for Electronics Cooling
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume -, Issue -, Pages -
Publisher
ASME International
Online
2020-10-23
DOI
10.1115/1.4048861

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