Research progress of diamond/copper composites with high thermal conductivity

Published 2020 View Full Article

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Title
Research progress of diamond/copper composites with high thermal conductivity
Authors
Keywords
Diamond/copper, Composites, Preparation method, High thermal conductivity, Interface bonding
Journal
DIAMOND AND RELATED MATERIALS
Volume 108, Issue -, Pages 107993
Publisher
Elsevier BV
Online
2020-07-04
DOI
10.1016/j.diamond.2020.107993

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