Research progress of diamond/copper composites with high thermal conductivity

出版年份 2020 全文链接

标题

作者

关键词

Diamond/copper, Composites, Preparation method, High thermal conductivity, Interface bonding

出版物

Volume 108, Issue -, Pages 107993

出版商

Elsevier BV

发表日期

2020-07-04

DOI

10.1016/j.diamond.2020.107993

联系作者

Discuss science. Find collaborators. Network.

Join a conversation

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started